Systems and methods for reducing contact to gate shorts

ABSTRACT

A method for reducing contact to gate shorts in a semiconductor device and the resulting semiconductor device are described. In one embodiment, a gate is formed on a substrate, a contact is formed on the gate and the substrate, and an insulator is formed between the gate and the contact. The insulator may be formed by oxidizing the gate to form a dielectric between the contact and the gate after the contact is formed on the gate.

This is a Divisional application of Ser. No.: 11/644,639 filed Dec. 21,2006, which is presently pending

FIELD

The present invention relates generally to semiconductor structures andmanufacturing. In particular, the present invention relates to a processfor reducing contact to gate shorts in a semiconductor device, and theresulting semiconductor device.

BACKGROUND

Advances in semiconductor manufacturing technology have led to theintegration of billions of circuit elements, such as transistors, on asingle integrated circuit (IC). In order to integrate increasing numbersof circuit elements onto an integrated circuit it has been necessary toreduce the dimensions of the electronic devices (e.g., ametal-oxide-semiconductor (MOS) transistor).

A transistor 10, made using conventional techniques, is shown in FIG. 1of the accompanying drawings. The transistor 10 includes a substrate 12,a channel region 14, source region 16, drain region 18, source contact20, drain contact 22, gate dielectric layer 24, gate electrode 26 andspacers 27. The transistor may also include contact terminals 28 and 30and gate terminal 32.

The gate dielectric layer 24 is formed on the substrate 10, over thechannel region 14. The gate electrode 26 is formed on the gatedielectric layer 24. The source and drain regions 16, 18 are formed onopposing sides of the channel region 14 in the substrate. The source anddrain contacts 20, 22 are formed over the source and drain regions 16,18, respectively. The spacers are provided on opposite sides of the gatedielectric layer 24 and gate electrode 26, and over the source and drainregions 16, 18. The gate electrode 26 may be a p-type, n-type or mid-gapmetal. The contact terminals 28 and 30 are connected to the source anddrain contacts 20 and 22, respectively, and gate terminal 32 isconnected to gate electrode 26. As shown in FIGS. 1 and 2, the contacts20, 22 are separated by a distance from the gate electrode 26. Thisdistance is typically referred to as a registration window.

In use, a voltage is applied to the source region 16 of the transistor10, causing current to flow through the channel region 14 to the drain18. A voltage is also applied to the gate electrode 26 of thetransistor, which interferes with the current flowing in the channelregion 14 of the transistor. The voltage connected to the gate electrode26 switches the current on and off in the channel region 14 of thetransistor at any given time. A circuit diagram of an n-channeltransistor is shown in FIG. 3. A circuit diagram of a p-channeltransistor is shown in FIG. 4.

If the metallic gate electrode 26 and metallic contacts 20, 22 come intocontact, a short circuit occurs. In conventional processes, theregistration window and critical dimensions are controlled to ensurethat the contacts 20, 22 avoid the gate electrode 26. However,protecting the gate from the contact is becoming more challenging as thegate pitch is getting smaller and registration requirements are becomingmore difficult to meet with existing processes. For example, a sub-tennm contact CD (critical dimension) is required to deliver amanfucaturable registration window for these scaled transistors;however, current processes only allow a registration window of about 15nm. These contact to gate shorts are substantial yield limiters.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is described by way of example with reference to theaccompanying drawings, wherein:

FIG. 1 is a side sectional view of a transistor;

FIG. 2 is a top view of the transistor of FIG. 1;

FIG. 3 is a circuit diagram of a n-channel MOSFET;

FIG. 4 is a circuit diagram of a p-channel MOSFET;

FIG. 5 is a side sectional view showing formation of a gate dielectricon a substrate according to an embodiment of the invention;

FIG. 6 is a schematic side view showing formation of a gate electrode onthe substrate according to an embodiment of the invention;

FIG. 7 is a side sectional view showing formation of source and drainregions in a substrate according to an embodiment of the invention;

FIG. 8 is a side sectional view showing formation of spacers accordingto an embodiment of the invention;

FIG. 9 is a side sectional view showing formation of a source and draincontacts according to an embodiment of the invention;

FIG. 10 is a side sectional view showing oxidation of the semiconductordevice according to an embodiment of the invention;

FIG. 11 is a side sectional view showing formation of an insulationlayer between the gate electrode and a portion of the contacts accordingto an embodiment of the invention;

FIG. 12 is a top view of the semiconductor device of FIG. 11;

FIG. 13 is a side sectional view showing a semiconductor device havingan insulation layer and a gate electrode having a polysilicon and metalsilicide layer according to an embodiment of the invention;

FIG. 14 is a perspective view of a tri-gate transistor according to anembodiment of the invention; and

FIG. 15 is a block diagram showing a method of making a semiconductordevice according to an embodiment of the invention.

DETAILED DESCRIPTION

In one embodiment, contact to gate shorts are reduced by separating thegate and contact after the contact touches the gate. That is, the gateand contact are isolated from one another where a short circuit occurs.In particular, in one embodiment, a short circuit caused by the contacttouching the gate is reversed by growing an oxidation layer on theshorted part of the gate. The oxidation layer forms a dielectric thatinsulates the gate from the contacts, thereby reversing the shortcircuit.

FIGS. 5-11 show a process for forming a semiconductor device 100 (FIG.11) according to one embodiment of the invention.

As shown in FIG. 5, the process begins by providing a substrate 110.

Any well-known substrate, such as, but not limited to, a monocrystallinesilicon may be used. In one embodiment the substrate 110 is a siliconwafer. The substrate 110 may be formed from other materials, such as,but not limited to, germanium, indium antimonide, lead telluride, indiumarsenide, indium phosphide, gallium arsenide, gallium antimonide and thelike. The substrate 110 may be a silicon-on-insulator structure.

With reference back to FIG. 5, the process continues by depositing adielectric layer 124 on the substrate 110. In one embodiment, thedielectric layer 124 is a gate dielectric layer.

In one embodiment, the dielectric layer 124 is made of a high-kmaterial; that is, the high-k dielectric layer 124 is made of a materialhaving a dielectric constant (k) greater than that of silicon dioxide(e.g., 4). Some of the materials that may be used to make the high-kgate dielectric layer 12 include, but are not limited to: hafnium oxide,lanthanum oxide, zirconium oxide, zirconium silicon oxide, titaniumoxide, tantalum oxide, barium strontium titanium oxide, barium titaniumoxide, strontium titanium oxide, yttrium oxide, aluminum oxide, leadscandium tantalum oxide, lead zinc niobate, and the like.

In one embodiment, the dielectric is made from non-high-k materials,such as for example, silicon dioxide or other non-high k materials.

In one embodiment, the dielectric layer 124 is sufficiently thick toelectrically isolate the substrate from a subsequently formed gateelectrode. In one embodiment, the thickness of the dielectric layer 124is about 5-25 angstroms.

The dielectric layer 124 may be formed on substrate 112 using anysuitable technique including, but not limited to, atomic layerdeposition (ALD), thermal oxidation, chemical vapor deposition (CVD) andphysical vapor deposition (PVD) processes. In one embodiment, thedielectric layer is formed by an ALD process. In the ALD process, thedielectric layer 12 is formed by exposing the substrate to alternatingmetal-containing precursors and oxygen-containing precursors until alayer having the desired thickness has been formed. Exemplary metalprecursors include hafnium tetrachloride and lanthanum trichloride. Anexemplary oxygen-containing precursor is water. In another embodiment,the dielectric layer 124 is formed by depositing a metal layer on thesubstrate and then thermally oxidizing the metal layer.

The process continues by depositing a gate electrode 126 on thedielectric layer 124, as shown in FIG. 6.

In one embodiment, the gate electrode 126 is metallic. A single metal ormultiple metals may be used. Exemplary metals include, but are notlimited to, aluminum (Al); titanium (Ti); molybdenum (Mo); tungsten (W);metal nitrides and carbides, such as, Ti_(x) N_(y), Ti_(x) C_(y)Ta_(x)N_(y), Ta_(x)C_(y); and, the like. In an embodiment for a PMOStransistor, a p-type metal having a p-type work function (WF=4.9-5.3 eV)is used. In an embodiment for a NMOS transistor, a n-type metal having an-type work function (WF=3.9-4.3 eV) is used. In another embodiment, amid-gap metal (WF=4.3-4.9 eV) may be used.

In one embodiment, the gate electrode 126 is a metallic silicide. Itwill be appreciated that the gate electrode may be formed entirely ofmetallic silicide, substantially entirely of metallic silicide orpartially of metallic silicide. In an embodiment wherein the gateelectrode 126 is a metallic silicide, the gate electrode 126 istypically formed of polysilicon when it is deposited, and issubsequently converted partially, substantially entirely, or entirelyinto metallic silicide as known to those of skill in the art. In oneembodiment, the metallic silicide is, for example, nickel silicide.

The gate electrode 126 is deposited using any well known process.

A polishing process, such as chemical mechanical polishing (CMP), may beperformed to planarize the surface and expose the gate electrode 126.

The gate electrode 126 may be subsequently patterned with, for example,well-known photolithography and etching techniques.

The process continues, as shown in FIG. 7, by implanting the substrate110 with ions to form source 116 and drain 118. A channel region 114 isthereby formed between the source and drain 116, 118. The ions may beimplanted using well-known ion implantation techniques.

As shown in FIG. 8, the process may continue by depositing spacers 127.Spacers 127 seal the sides of the gate electrode 126 and encapsulate thegate dielectric layer 124.

The spacers 127 are typically made of nitride or oxide. Exemplaryspacers materials include, not are not limited to, silicon nitride,carbon doped nitride, and carbon doped nitride without oxide components.

In one embodiment, the spacers 127 are formed by a CVD process. Otherwell-known processes may be used to form the spacers 127.

In one embodiment, a high temperature step may follow spacer deposition,which anneals the dielectric layer 124 and activates the implanteddopants. In one embodiment, the high temperature step is a source drainanneal (SDAL). In one embodiment, the high temperature step is a rapidthermal anneal (RTA).

In one embodiment, silicide is formed during the high temperature step.In particular, in one embodiment, self-aligned silicide (SALICIDE) maybe formed during the high temperature step. The silicide may be used toform low-resistance contacts and/or a gate electrode comprisingsilicide. In one embodiment, the gate electrode may be formed partiallyof polysilicon and partially of the metallic silicide, entirely of themetallic silicide or substantially entirely of the metallic silicide.

As shown in FIG. 9, the source contact 120 is formed over the sourceregion 116, the drain contact 122 is formed over the drain region 118,and a portion of the contacts 120, 122 may be formed at least in part onthe gate electrode 126. As explained hereinabove, the formation of themetallic contacts 120, 122 on the metallic gate electrode 126 results ina short circuit of the semiconductor device. It will be appreciated thatduring the process, the contacts may not be formed on the gate electrodeat all either the source contact or the drain contact may be formed onthe gate electrode, or both the source contact and the drain contact maybe formed on the gate electrode. It will also be appreciated that theamount of the contact that contacts the gate electrode may vary.

With reference to FIG. 10, the short circuit may be reversed byoxidizing the gate electrode 126. That is, after the short circuit iscreated by the one or more metallic contacts touching the gateelectrode, an oxidation process may be used to form a dielectric betweenthe contact(s) and the gate electrode. The dielectric reverses the shortcircuit by acting as an insulator, preventing electron flow between thecontacts and the gate electrode.

In one embodiment, the oxidization process includes etching with anoxygen rich plasma and a thermal cycle on an asher. For example, a highoxygen plasma etch on an etcher for about five minutes may be followedby about a ten second high temperature (273) ash may be used. Otheroxidation processes may be used to reverse the short circuit.

As shown in FIG. 11 the oxidation process forms an insulator 150, 152 atthe portions where the contacts 120, 122 contact the gate electrode 126.The oxidation layer is formed on any exposed metal. It will beappreciated that because the gate electrode 126 and contacts 120, 122are typically protected by a thin layer of nitride, the only exposedmetal that will oxidize should be where the contacts 120, 122 touch thegate electrode 126.

The insulators 150, 152 may be a dielectric material. In one embodiment,the dielectric material is nickel oxide. It will be appreciated thatother dielectric materials may be formed depending on the gate material.The insulators 150, 152 are formed from a material and has a thicknesssufficient to prevent electron flow between the contacts 120, 122 andthe gate electrode 156.

The semiconductor device 100 formed using the above process, shown inFIG. 11, includes a substrate 110, a channel region 114, source region116, drain region 118, source contact 120, drain contact 122, gatedielectric layer 124, gate electrode 126 and spacers 127. In addition,the semiconductor device 100 may include a source insulator 150 and/or adrain insulator 152. As explained above, the insulators 150, 152 areformed between the gate electrode 126 and source contact 120 and draincontact 122, respectively, where the gate electrode 126 and contacts120, 122 touch one another.

FIG. 12 is a top view showing a semiconductor device 100 formed usingthe above process. As shown in FIG. 12, a portion of the contacts 120,122 may overlap a portion of the gate electrode 126. The resultingsemiconductor device 100 does not short circuit because the insulators150, 152 are present between the contacts 120, 122 and the gateelectrode 126.

FIG. 13 is a side sectional view of a semiconductor device 200 formedusing a process similar to that described above with reference to FIGS.5-11. The semiconductor device 200 includes a substrate 210, a channelregion 214, source region 216, drain region 218, source contact 220,drain contact 222, gate dielectric layer 224, gate electrode 226 andspacers 227.

The gate electrode 226 includes a metallic silicide portion 226 a and apolysilicon portion 226 b. As with semiconductor device 100, thesemiconductor device 200 short circuits if the metallic contacts touchthe metallic silicide portion 226 a of the gate electrode 226. Byoxidizing the metallic silicide portion 226 a of the gate electrode 226as described above with reference to FIG. 10, insulators 250, 252 may beformed between the contacts 220, 222 and the metallic portion 226 a ofthe gate electrode 226. In one embodiment, the metallic silicide portion226 a and the contacts are formed from a nickel silicide.

FIG. 14 is a perspective view of a tri-gate transistor 300, manufacturedusing the methods described in FIGS. 6-12, according to an embodiment ofthe invention. In one embodiment, the tri-gate transistor 300 includesinsulators formed using the process described hereinabove with respectto semiconductor device 100.

The transistor 300 includes a substrate 310, a semiconductor body 342, agate dielectric layer 312, a gate electrode 324, a source region, 332, adrain region 334, and a channel region 336. The substrate 10 includes alower monocrystalline substrate 344 and an insulating layer 346. Thesemiconductor body 342 includes a pair of laterally opposite sidewalls348 and 350 separated by a distance which defines a semiconductor bodywidth 352, and a top surface 354 and a bottom surface 356 separated by adistance which defines a semiconductor body height 358. The gateelectrode 324 has a pair of laterally opposite sidewalls 360 and 362separated by a distance which defines the gate length 364 of thetransistor 300.

The substrate 310 can be an insulating substrate or a semiconductorsubstrate. The dielectric layer 312 is formed on the top surface 354 andsidewalls 348, 350 of the semiconductor body 342. The gate electrode 324is formed on the dielectric layer 312 of the top surface 354 of thesemiconductor body 342 and is formed adjacent to the gate dielectriclayer 312 formed on the sidewalls 348, 350 of the semiconductor body342. The source and drain regions 332, 334 are formed in thesemiconductor body 342 on opposite sides of the gate electrode 324. Thegate electrode 324 may be a p-type, n-type of mid-gap metal.

Because the gate electrode 324 and the gate dielectric 312 surround thesemiconductor body 342 on three sides, the transistor essentially hasthree separate channels and gates (g1, g2, g3). The gate “width” of atransistor is equal to the sum of each of the three sides of thesemiconductor body Larger “width” transistors can be formed byconnecting several tri-gate transistors together.

The gates of transistor 340 are connected to a voltage source. A voltageis applied to source region 332, causing current to flow through thechannel region 336 to the drain region 334. A voltage is also applied tothe gate electrode 324, which interferes with the current flowing in thechannel region 336. The voltage connected to the gate electrode 324switches the current on and off in the channel region (g1, g2, g3).

An insulating layer (not shown) may be present between the gateelectrode and source and drain contacts (not shown), formed as describedabove, to reverse a short circuit that may occur if the contacts touchthe gate electrode 324.

FIG. 15 is a block diagram showing a process 500 for forming asemiconductor device according to an embodiment of the invention. In oneembodiment, the semiconductor device is semiconductor devices 100, 200or 300 described above with reference to FIGS. 5-14.

The process 500 begins at block 502, wherein a gate is formed on asubstrate. The process continues at block 504 by forming a contact onthe gate and the substrate. The process continues at block 506, byoxidizing the gate to form a dielectric between the contact and the gateafter the contact is formed on the gate. It will be appreciated that theprocess 50 may include additional or fewer steps as described herein andas appreciated by those of skill in the art.

Embodiments of the present invention may be advantageous becauseoxidizing the shorted area of the gate offers a robust manufacturableprocess. In one embodiment, a major yield limiter (contact to gateshorts) is reduced or eliminated and major constraints for contactpatterning are alleviated, allowing for more variability. From alithography perspective, registration windows may be increased to allowfor more critical dimension variability. From an etch perspective, theprocess may be more tolerant for different profiles (and hence criticaldimensions) and time over-etches.

The methods which are described and illustrated herein are not limitedto the exact sequence of acts described, nor are they necessarilylimited to the practice of all of the acts set forth. Other sequences ofevents or acts, or less than all of the events, or simultaneousoccurrence of the events, may be utilized in practicing the embodimentsof the present invention.

The foregoing description with attached drawings is only illustrative ofpossible embodiments of the described method and should only beconstrued as such. Other persons of ordinary skill in the art willrealize that many other specific embodiments are possible that fallwithin the scope and spirit of the present idea. The scope of theinvention is indicated by the following claims rather than by theforegoing description. Any and all modifications which come within themeaning and range of equivalency of the following claims are to beconsidered within their scope.

1. A method for making a semiconductor device comprising: forming a gateon a substrate; forming a contact on the gate and the substrate; andforming an insulator between the gate and the contact.
 2. The method ofclaim 1, wherein forming the insulator comprises forming a dielectric.3. The method of claim 1, wherein forming the insulator comprisesoxidizing a portion of the gate in contact with the contact.
 4. Themethod of claim 3, wherein oxidizing comprises etching with an oxygenrich plasma and a thermal cycle on an asher.
 5. The method of claim 3,wherein oxidizing comprises oxidizing the gate after the contact isformed over the gate.
 6. The method of claim 1, wherein the insulator isformed between the gate and the contact after the contact touches thegate.
 7. The method of claim 1, wherein the gate is metallic.
 8. Themethod of claim 1, wherein the gate comprises a polysilicon gate havinga salicided metal thereon.
 9. The method of claim 1, wherein the gatecomprises nickel salicide.
 10. The method of claim 1, wherein formingthe insulator comprises oxidizing the gate to form a dielectric betweenthe contact and the gate after the contact touches the gate.